IPC SMC-TR-001

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This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT.

Product Details

Published:

01/01/1989

Number of Pages:

54

File Size:

1 file , 1.4 MB