IPC SM-840D

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Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision D incorporates resistance requirements to lead free soldering processes.

Product Details

Published:

04/01/2007

ANSI:

ANSI Approved

Number of Pages:

16

File Size:

1 file , 260 KB