Side Navigation

X

JEDEC JESD22-A122A

Click here to purchase
This Test Method establishes a uniform method for performing component package power cycling stress test. This specification covers power induced temperature cycling of a packaged component, simulating the non-uniform temperature distribution resulting from a device powering on and off in the application.

Product Details

Published:
06/01/2016
Number of Pages:
21
File Size:
1 file , 120 KB

You May Also Like