JEDEC JEP131B

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This publication applies to electronic components and subassemblies product and or process development, manufacturing processes and the associated performance requirements in customer applications. These areas should include, but are not limited to: package design, chip design, process development, assembly, fabrication, manufacturing, materials, quality, service, and suppliers, as well as the process requirements needed for the next assembly.

Product Details

Published:

04/01/2012

Number of Pages:

26

File Size:

1 file , 160 KB