IEC 63011-3 Ed. 1.0 b:2018

Click here to purchase
IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.

Product Details

Edition:

1.0

Published:

11/28/2018

Number of Pages:

28

File Size:

1 file , 2.5 MB