IEC 63011-1 Ed. 1.0 b:2018
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IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
Product Details
- Edition:
- 1.0
- Published:
- 11/28/2018
- Number of Pages:
- 24
- File Size:
- 1 file , 1.3 MB