IEC 62418 Ed. 1.0 b:2010
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IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
Product Details
- Edition:
- 1.0
- Published:
- 04/22/2010
- Number of Pages:
- 34
- File Size:
- 1 file , 990 KB