Side Navigation

X

IEC 62418 Ed. 1.0 b:2010

Click here to purchase
IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

Product Details

Edition:
1.0
Published:
04/22/2010
Number of Pages:
34
File Size:
1 file , 990 KB

You May Also Like