IEC 62374-1 Ed. 1.0 b:2010

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IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

Product Details

Edition:

1.0

Published:

09/29/2010

Number of Pages:

32

File Size:

1 file , 490 KB