IEC 62047-16 Ed. 1.0 b:2015

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IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.

Product Details

Edition:

1.0

Published:

03/05/2015

Number of Pages:

21

File Size:

1 file , 420 KB