IEC 60684-3-281 Ed. 1.0 b:2010

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IEC 60684-3-281:2010 gives the requirements for two types of heat-shrinkable, polyolefin sleeving, semiconductive, with a nominal shrink ratio of 3:1. This sleeving has been found suitable up to temperatures of 100 °C.

• Type A: Thin wall – Internal diameter up to 195,0 mm typically;
• Type B: Medium wall – Internal diameter up to 120,0 mm typically

Product Details

Edition:

1.0

Published:

06/10/2010

Number of Pages:

20

File Size:

1 file , 850 KB