IPC 2231A

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This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

Product Details

Published:

08/01/2021

Number of Pages:

60

File Size:

1 file , 1.9 MB

Product Code(s):

2231-STD-0-P-0-EN-A, 2231-STD-0-P-0-EN-A