IEC 60749-20 Ed. 3.0 b:2020

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This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

Product Details

Edition:

3.0

Published:

08/01/2020

ISBN(s):

9782832287279

Number of Pages:

60

File Size:

1 file , 2.5 MB

Note:

This product is unavailable in Belarus, Russia, Ukraine