IPC 4555

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This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).

Product Details

Published:

04/01/2022

ISBN(s):

9781638160748

Number of Pages:

24

File Size:

1 file , 990 KB

Product Code(s):

4555-STD-0-D-0-EN-0, 4555-STD-0-D-0-EN-0

Note:

This product is unavailable in Russia, Ukraine, Belarus