IPC 7092A

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This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.

Product Details

Published:

10/01/2022

ISBN(s):

9781638160946

Number of Pages:

124

File Size:

1 file , 8.2 MB

Note:

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