IPC 4781
Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink
standard by Association Connecting Electronics Industries, 05/01/2008
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IPC 4921
Requirements for Printed Electronics Base Materials (Substrates)
standard by Association Connecting Electronics Industries, 06/01/2012
IPC 6012A-AM
Qualification and Performance Specification for Rigid Printed Boards – Includes Amendment 1
standard by Association Connecting Electronics Industries, 10/01/1999
IPC 6013A
Qualification and Performance Specification for Flexible Printed Boards, Includes Amendment 2
standard by Association Connecting Electronics Industries, 04/01/2006
IPC 9301
Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
standard by Association Connecting Electronics Industries, 12/01/2018
IPC J-STD-003C
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2013
IPC J-STD-020C
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Device
standard by Association Connecting Electronics Industries, 07/01/2004
IPC OI-645
Standard for Visual Optical Inspection Aids
standard by Association Connecting Electronics Industries, 10/01/1993
IPC PERM-WP-022
White Paper on Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow – Results of an Industry Round-Robin – Final Report
standard by Association Connecting Electronics Industries, 09/05/2018
IPC TR-584A
IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies (Correcting the Misunderstandings on "Halogen-Free")
standard by Association Connecting Electronics Industries, 08/01/2007