IPC 2578
Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data – Product Data eXchange
standard by Association Connecting Electronics Industries, 11/01/2001
Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data – Product Data eXchange
standard by Association Connecting Electronics Industries, 11/01/2001
Metal Foil for Printed Wiring Applications, Includes Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2000
Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
standard by Association Connecting Electronics Industries, 02/01/1998
Troubleshooting for Printed Board Fabrication Processes
standard by Association Connecting Electronics Industries, 02/01/2016
Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
standard by Association Connecting Electronics Industries, 09/27/2017
High Temperature Printed Board Flatness Guideline
standard by Association Connecting Electronics Industries, 06/01/2013
Guidelines for Assembly of Single-Sided and Double-Sided Flexible Printed Circuits
Handbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/1992
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
standard by Association Connecting Electronics Industries, 08/01/2014
Standards for Printed Board Assembly Manual
standard by Association Connecting Electronics Industries,