IPC 2222A
Sectional Design Standard for Rigid Organic Printed Boards
standard by Association Connecting Electronics Industries, 12/01/2010
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IPC 3406
Guidelines for Electrically Conductive Surface Mount Adhesives
standard by Association Connecting Electronics Industries, 07/01/1996
IPC 6018C
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2016
IPC 9706
Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
standard by Association Connecting Electronics Industries, 12/01/2013
IPC A-39
Small Hole Reliability Round Robin Artwork
standard by Association Connecting Electronics Industries, 09/01/1988
IPC A-630
Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
standard by Association Connecting Electronics Industries, 09/01/2013
IPC EMBPAS03
IPC International Conference on Embedded Passives "The Faster and Cleaner Electronic Signals for the Future" – Northbrook, IL – June 2003
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
IPC J-STD-020E
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
standard by Association Connecting Electronics Industries, 01/01/2015
IPC J-STD-075
Classification of Non-IC Electronic Components for Assembly Processes
standard by Association Connecting Electronics Industries, 08/01/2008
IPC SM-839
Pre and Post Solder Mask Application Cleaning Guidelines
standard by Association Connecting Electronics Industries, 04/01/1990