IPC A-28-G
SMT Assembly Benchmark Artwork – Gerber Format
standard by Association Connecting Electronics Industries,
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IPC A-600H
Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2010
IPC A-610F
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014
IPC CH-65B
Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/2011
IPC J-STD-002D
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 06/01/2013
IPC J-STD-026
Semiconductor Design Standard for Flip Chip Applications
standard by Association Connecting Electronics Industries, 04/01/1999
IPC JP002
JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
standard by Association Connecting Electronics Industries, 03/01/2006
IPC T-50H
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 07/01/2008
IPC TR-465-2
The Effect of Steam Aging Time and Temperature on Solderability Test Results
standard by Association Connecting Electronics Industries, 01/01/1993
IPC WP-1081
White Paper on Conflict Minerals Due Diligence Guidance
standard by Association Connecting Electronics Industries, 07/01/2015