Harmonized system of quality assessment for electronic components. Fixed capacitors for use in electronic equipment. Sectional specification: fixed metallized polyethylene terephthalate film dielectric d.c. capacitors
standard by BSI Group, 10/31/1983
Specification for aircraft material. 3 per cent chromium-molybdenum-vanadium steel (air hardening) (100 tonf/sq in: limiting ruling section 1 1/8 inches)
standard by BSI Group, 10/28/1965
Fixed film resistor networks for use in electronic equipment. Blank detail specification for film resistor networks of assessed quality on the basis of the capability approval procedure. Assessment level E
standard by BSI Group, 09/15/1992
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: electromechanical switches for use in electronic equipment. Blank detail specification for in-line package switches
standard by BSI Group, 10/15/1992
Harmonized system of quality assessment for electronic components. Semiconductor devices. Optoelectronic devices. Blank detail specification for pin-FET modules with/without pigtail, for fibre optic systems or subsystems
standard by BSI Group, 09/15/1997
Specification for design and performance requirements for toggle type panel fasteners
standard by BSI Group, 03/31/1970
Specification for cold drawn 18/10 chromium-nickel corrosion-resisting steel tube (titanium stabilized: 800 N/mm^2) (weldable)
standard by BSI Group, 10/27/1972
Harmonized system of quality assessment for electronic components. Fixed capacitors for use in electronic equipment. Sectional specification: aluminium electrolytic capacitors with solid and non-solid electrolyte
standard by BSI Group, 12/15/1998
Specification for forging stock of titanium-copper alloy (tensile strength 650-880 N/mm^2) (limiting ruling section 75 mm)
standard by BSI Group, 04/30/1973
