Determining the peak spatial-average specific absorption rate (SAR) in the human body from wireless communications devices, 30 MHz to 6 GHz – Part 1: General requirements for using the finite-difference time-domain (FDTD) method for SAR calculations
standard by International Electrotechnical Commission, 10/01/2017
Fibre optic communication subsystem test procedures – Part 1-3: General communication subsystems – Measurement of central wavelength, spectral width and additional spectral characteristics
standard by International Electrotechnical Commission, 07/01/2021
Household and similar electrical appliances – Safety – Part 2-39: Particular requirements for commercial electric multi-purpose cooking pans CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 11/01/2021
Electric room heating – Underfloor heating – Performance characteristics – Definitions, method of testing, sizing and formula symbols CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 10/01/2021
Connectors for electrical and electronic equipment – Part 6: Detail specification for 2-way and 4-way (data/power), shielded, free and fixed connectors for power and data transmission with frequencies up to 600 MHz.
standard by International Electrotechnical Commission, 10/01/2021
Industrial communication networks – High availability automation networks – Part 3: Parallel Redundancy Protocol (PRP) and High-availability Seamless Redundancy (HSR)
standard by International Electrotechnical Commission, 12/01/2021
Organic light emitting diode (OLED) panels for general lighting – Performance requirements CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 08/01/2021
Touch and interactive displays – Part 1-3: Generic – General introduction to pen touch technology
standard by International Electrotechnical Commission, 07/01/2021
Fibre-optic communication subsystem test procedures – Part 4-1: Installed cabling plant – Multimode attenuation measurement CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 12/01/2021
Semiconductor devices – Micro-electromechanical devices – Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
standard by International Electrotechnical Commission, 06/01/2021