Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
standard by International Electrotechnical Commission, 04/26/2007
Printed boards and printed board assemblies – Design and use – Part 5-4: Attachment (land/joint) considerations – Components with J leads on two sides
standard by International Electrotechnical Commission, 10/30/2007
Distribution automation using distribution line carrier systems – Part 4-33: Data communication protocols – Data link layer – Connection oriented protocol
standard by International Electrotechnical Commission, 07/10/1998
Household high-fidelity audio equipment and systems – Methods of measuring and specifying the performance – Part 2: FM radio tuners
standard by International Electrotechnical Commission, 11/13/1997
Functional safety of electrical/electronic/programmable electronic safety-related systems – Part 1: General requirements (see
standard by International Electrotechnical Commission, 04/30/2010
Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-34: Tests – Resistance to solvents and contaminating fluids of interconnecting components and closures
standard by International Electrotechnical Commission, 05/13/2009
Live working – Voltage detectors – Part 3: Two-pole low-voltage type
standard by International Electrotechnical Commission, 11/20/2009
Corrigendum 1 – Low-voltage switchgear and controlgear assemblies – Part 7: Assemblies for specific applications such as marinas, camping sites, market squares, electric vehicle charging stations
Amendment by International Electrotechnical Commission, 08/27/2019
Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-17: Tests – Cold
standard by International Electrotechnical Commission, 11/29/2010
Fibre optic communication subsystem test procedures – Part 1-4: General communication subsystems – Collection and reduction of two-dimensional nearfield data for multimode fibre laser transmitters
standard by International Electrotechnical Commission, 01/23/2003