Semiconductor devices – Micro-electromechanical devices – Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
standard by International Electrotechnical Commission, 11/22/2017
Discharge lamps (excluding flourescent lamps) – Safety specifications
standard by International Electrotechnical Commission, 04/10/2014
Railway applications – Fixed installations – DC switchgear – Part 3: Indoor d.c. disconnectors, switch-disconnectors and earthing switches
standard by International Electrotechnical Commission, 02/07/2006
Safety of power converters for use in photovoltaic power systems – Part 1: General requirements
standard by International Electrotechnical Commission, 04/28/2010
Passive RF and microwave devices, intermodulation level measurement – Part 6: Measurement of passive intermodulation in antennas
standard by International Electrotechnical Commission, 01/16/2013
Electrcity metering data exchange – The DLMS/COSEM suite – Part 5-3: DLMS/COSEM application layer
standard by International Electrotechnical Commission, 08/10/2017
Electrical insulation systems – Procedures for thermal evaluation – Part 21: Specific requirements for general-purpose models – Wire-wound applications
standard by International Electrotechnical Commission, 08/27/2004
Corrigendum 1 – Semiconductor devices – Micro-electromechanical devices – Part 5: RF MEMS switches
Corrigenda by International Electrotechnical Commission, 03/08/2012
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 07/27/2006
Amendment 1 – Recording – Helical-scan digital video cassette recording system using 6,35 mm magnetic tape for consumer use (525-60, 625-50, 1125-60 and 1125-50 systems) – Part 4: Pack header table and contents
standard by International Electrotechnical Commission, 05/11/2010