Printed electronics – Part 202-7: Materials – Printed film – Measurement of peel strength for printed layer on flexible substrate by 90 degrees peel method
standard by International Electrotechnical Commission, 03/03/2021
Corrigendum 1 – Wind energy generation systems – Part 6: Tower and foundation design requirements
Corrigenda by International Electrotechnical Commission, 11/24/2020
Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-55: Tests – Strength of mounted adaptor
standard by International Electrotechnical Commission, 03/09/2017
Corrigendum 1 – Industrial networks – Wireless communication network and communication profiles – WIA-FA
Corrigenda by International Electrotechnical Commission, 03/03/2021
Printed electronics – Part 302-3: Equipment – Inkjet – Imaging-based measurement of drop direction
standard by International Electrotechnical Commission, 01/21/2021
Surface mounting technology – Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
standard by International Electrotechnical Commission, 02/03/2021
Industrial communication networks – Fieldbus specifications – Part 4-4: Data-link layer protocol specification – Type 4 elements
standard by International Electrotechnical Commission, 04/18/2019
Power cables with extruded insulation and their accessories for rated voltages from 1 kV (Um = 1,2 kV) up to 30 kV(Um = 36 kV) – Part 1: Cables for rated voltages of 1 kV (Um = 1,2 kV) and 3 kV (Um = 3,6 kV)
standard by International Electrotechnical Commission, 02/09/2021
Amendment 1 – International Electrotechnical Vocabulary (IEV) – Part 841: Industrial electroheat
Amendment by International Electrotechnical Commission, 04/06/2021
Industrial communication networks – Profiles – Part 5-20: Installation of fieldbuses – Installation profiles for CPF 20
standard by International Electrotechnical Commission, 08/30/2018