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IEC 62047-3 Ed. 1.0 b:2006

Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing
standard by International Electrotechnical Commission, 08/15/2006

IEC 62047-13 Ed. 1.0 b:2012

Semiconductor devices – Micro-electromechanical devices – Part 13: Bend – and shear – type test methods of measuring adhesive strength for MEMS structures
standard by International Electrotechnical Commission, 02/28/2012

IEC 62054-11 Ed. 1.1 en:2016

Electricity metering (a.c.) – Tariff and load control – Part 11:Particular requirements for electronic ripple control receivers CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 11/18/2016

IEC 62047-11 Ed. 1.0 b:2013

Semiconductor devices – Micro-electromechanical devices – Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
standard by International Electrotechnical Commission, 07/17/2013

IEC 62148-9 Ed. 1.0 b:2003

Fibre optic active components and devices – Package and interface standards – Part 9: SFF MU duplex 10-pin transceivers
standard by International Electrotechnical Commission, 02/10/2003

IEC 62288 Ed. 2.0 b:2014

Maritime navigation and radiocommunication equipment and systems – Presentation of navigation-related information on shipborne navigational displays – General requirements, methods of testing and required test results
standard by International Electrotechnical Commission, 07/10/2014

IEC 62005-7 Ed. 1.0 b:2004

Reliability of fibre optic interconnecting devices and passive optical components – Part 7: Life stress modeling
standard by International Electrotechnical Commission, 01/23/2004