IEC 62108 Ed. 2.0 b:2016
Concentrator photovoltaic (CPV) modules and assemblies – Design qualification and type approval
standard by International Electrotechnical Commission, 09/26/2016
Concentrator photovoltaic (CPV) modules and assemblies – Design qualification and type approval
standard by International Electrotechnical Commission, 09/26/2016
Fibre optic interconnecting devices and passive components – Reliability – Part 9-4: High power qualification of passive optical components for environmental category C
standard by International Electrotechnical Commission, 07/25/2018
Semiconductor devices – Micro-electromechanical devices – Part 25: Silicon based MEMS fabrication technology – Measurement method of pull-press and shearing strength of micro bonding area
standard by International Electrotechnical Commission, 08/29/2016
Surface mounting technology – Environmental and endurance test methods for surface mount solder joints – Part 1-5: Mechanical shear fatigue test
standard by International Electrotechnical Commission, 02/11/2009
Ferrite cores – Dimensions – Part 13: PQ-cores for use in power supply applications
standard by International Electrotechnical Commission, 08/20/2015
Digital audio – Interface for non-linear PCM encoded audio bitstreams applying to IEC 60958 – Part 7: Non-linear PCM bitstreams according to the ATRAC, ATRAC2/3 and ATRAC-X formats
standard by International Electrotechnical Commission, 11/24/2004
High-voltage switchgear and controlgear – Part 203: Gas-insulated metal-enclosed switchgear for rated voltages above 52 kV
standard by International Electrotechnical Commission, 09/07/2011
Industrial-process measurement and control – Data structures and elements in process equipment catalogues – Part 92: Lists of properties (LOP) of measuring equipment for electronic data exchange – Aspect LOPs
standard by International Electrotechnical Commission, 06/05/2018
Hydroelectric power plant automation – Guide for computer-based control
standard by International Electrotechnical Commission, 04/28/2004
Semiconductor devices – Micro-electromechanical devices – Part 15: Test method of bonding strength between PDMS and glass
standard by International Electrotechnical Commission, 03/05/2015