IEC 62374-1 Ed. 1.0 b:2010
Semiconductor devices – Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
standard by International Electrotechnical Commission, 09/29/2010
Semiconductor devices – Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
standard by International Electrotechnical Commission, 09/29/2010
Determination of certain substances in electrotechnical products – Part 6: Polybrominated biphenyls and polybrominated diphenyl ethers in polymers by gas chromatograhy -mass spectometry (GC-MS)
standard by International Electrotechnical Commission, 06/05/2015
Measurement procedure for the assessment of specific absorption rate of human exposure to radio frequency fields from hand-held and body-mounted wireless communication devices – Part 1: Devices used next to the ear (Frequency range of 300 MHz to 6 GHz)
standard by International Electrotechnical Commission, 07/06/2016
Static transfer systems (STS) – Part 1: General and safety requirements
standard by International Electrotechnical Commission, 03/08/2005
Safety of machinery – Application of protective equipment to detect the presence of persons
standard by International Electrotechnical Commission, 03/28/2018
Framework for energy market communications – Part 451-2: Scheduling business process and contextual model for CIM European market
standard by International Electrotechnical Commission, 05/08/2014
Fibre optic active components and devices – Performance standards – Part 4: 1300 nm fibre optic transceivers for Gigabit Ethernet application
standard by International Electrotechnical Commission, 01/27/2003
Calibration of optical spectrum analyzers
standard by International Electrotechnical Commission, 01/16/2006
Audio, video, and related equipment – Determination of power consumption – Part 1: General
standard by International Electrotechnical Commission, 06/05/2015
Field device tool (FDT) interface specification – Part 2: Concepts and detailed description
standard by International Electrotechnical Commission, 06/30/2009