Semiconductor devices – Part 18-5: Semiconductor bio sensors – Evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle of light
standard by International Electrotechnical Commission, 03/01/2023
Cores made of soft magnetic materials – Measuring methods – Part 3: Magnetic properties at high excitation level
standard by International Electrotechnical Commission, 07/01/2023
Industrial communication networks – Fieldbus specifications – Part 4-21: Data-link layer protocol specification – Type 21 elements
standard by International Electrotechnical Commission, 03/01/2023
Amendment 1 – Voltage Sourced Converter (VSC) Valves For Static Synchronous Compensator (STATCOM) – Electrical Testing
Amendment by International Electrotechnical Commission, 05/01/2023
Industrial networks – Profiles – Part 1-1: Fieldbus profiles – Communication Profile Family 1
standard by International Electrotechnical Commission, 03/01/2023
Field device integration (FDI®) – Part 102-2: Profiles – EtherNet/IP
standard by International Electrotechnical Commission, 04/01/2023
Medical electrical equipment – Part 2-57: Particular requirements for the basic safety and essential performance of non-laser light source equipment intended for therapeutic, diagnostic, monitoring and cosmetic/aesthetic use
standard by International Electrotechnical Commission, 07/01/2023
Industrial networks – Profiles – Part 2-14: Additional real-time fieldbus profiles based on ISO/IEC/IEEE 8802-3 – CPF 14
standard by International Electrotechnical Commission, 05/01/2023
E-Transporters – Part 1: Terminology and classification
standard by International Electrotechnical Commission, 07/01/2023
Electronic displays – Part 3-4: Evaluation of optical performances – High dynamic range displays
standard by International Electrotechnical Commission, 03/01/2023