IPC 1601A
Printed Board Handling and Storage Guidelines
standard by Association Connecting Electronics Industries, 06/01/2016
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IPC 2226
Sectional Design Standard for High Density Interconnect (HDI) Boards
standard by Association Connecting Electronics Industries, 05/01/2003
IPC 4411-AM1
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1
Amendment by Association Connecting Electronics Industries, 03/01/2001
IPC 2512A
Sectional Requirements for Implementation of Administrative Methods for Mfg. Data Description
standard by Association Connecting Electronics Industries, 11/01/2000
IPC 1072
Intellectual Property Protection in Electronic Assembly Manufacturing
standard by Association Connecting Electronics Industries, 12/01/2015
IPC 4202B
Flexible Base Dielectrics for Use in Flexible Printed Boards
standard by Association Connecting Electronics Industries, 12/01/2016
IPC 2141A
Design Guide for High-Speed Controlled Impedance Circuit Boards
standard by Association Connecting Electronics Industries, 03/01/2004
IPC 1071A
Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing
standard by Association Connecting Electronics Industries, 08/01/2014
IPC 4553
Specification for Immersion Silver Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 06/01/2005
IPC 4203B
Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 03/01/2018