• 2019-12-28
• Admin
• no comments

IPC 1601A

Printed Board Handling and Storage Guidelines
standard by Association Connecting Electronics Industries, 06/01/2016

• 2019-12-28
• Admin
• no comments

IPC 1072

Intellectual Property Protection in Electronic Assembly Manufacturing
standard by Association Connecting Electronics Industries, 12/01/2015

• 2019-12-28
• Admin
• no comments

IPC 4202B

Flexible Base Dielectrics for Use in Flexible Printed Boards
standard by Association Connecting Electronics Industries, 12/01/2016

• 2019-12-28
• Admin
• no comments

IPC 2141A

Design Guide for High-Speed Controlled Impedance Circuit Boards
standard by Association Connecting Electronics Industries, 03/01/2004

• 2019-12-28
• Admin
• no comments

IPC 1071A

Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing
standard by Association Connecting Electronics Industries, 08/01/2014

• 2019-12-28
• Admin
• no comments

IPC 2226

Sectional Design Standard for High Density Interconnect (HDI) Boards
standard by Association Connecting Electronics Industries, 05/01/2003

• 2019-12-28
• Admin
• no comments

IPC 4411-AM1

Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1
Amendment by Association Connecting Electronics Industries, 03/01/2001

• 2019-12-28
• Admin
• no comments

IPC 2512A

Sectional Requirements for Implementation of Administrative Methods for Mfg. Data Description
standard by Association Connecting Electronics Industries, 11/01/2000

• 2019-12-28
• Admin
• no comments

IPC 4553

Specification for Immersion Silver Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 06/01/2005

• 2019-12-28
• Admin
• no comments

IPC 6012DS

Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 2015