IPC 2226A
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017
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IPC 4203B
Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 03/01/2018
IPC 4556
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 01/01/2013
IPC 6013D Amendment 1
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards, Amendment 1
Amendment by Association Connecting Electronics Industries, 04/01/2018
IPC 6018A
Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 01/01/2002
IPC 7621
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
standard by Association Connecting Electronics Industries, 01/01/2018
IPC 7093
Design and Assembly Process Implementation for Bottom Termination Components
standard by Association Connecting Electronics Industries, 03/28/2011
IPC 4101B
Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)
standard by Association Connecting Electronics Industries, 06/01/2006
IPC 4562A
Metal Foil for Printed Board Applications
standard by Association Connecting Electronics Industries, 05/01/2008
IPC 4103
Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 01/01/2002