IPC Technology Solutions White Paper on Blockchain and the Electronics Industry: A Review of the Current State of Blockchain Technology and Its Potential Applications in Electronics Manufacturing
standard by Association Connecting Electronics Industries, 09/01/2019
Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology
standard by Association Connecting Electronics Industries, 03/01/2000
Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires
standard by Association Connecting Electronics Industries, 10/01/2019
Qualification and Performance Specification for Flexible Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2005
Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2008
General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/1994
Surface Insulation Resistance Handbook
standard by Association Connecting Electronics Industries, 09/01/2007
Spherical Bend Test Method for Characterization of Board Level Interconnects
standard by Association Connecting Electronics Industries, 09/01/2011
Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 12/01/2018
Monotonic Bend Characterization of Board-Level Interconnects
standard by Association Connecting Electronics Industries, 06/01/2004