IPC 4591
Requirements for Printed Electronics Functional Conductive Materials
standard by Association Connecting Electronics Industries, 11/01/2012
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IPC 2612
Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
standard by Association Connecting Electronics Industries, 03/01/2010
IPC CH-65A
Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1999
IPC 9201A
Surface Insulation Resistance Handbook
standard by Association Connecting Electronics Industries, 09/01/2007
IPC 9707
Spherical Bend Test Method for Characterization of Board Level Interconnects
standard by Association Connecting Electronics Industries, 09/01/2011
IPC 2251
Design Guide for the Packaging of High Speed Electronic Circuits
Handbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2003
IPC 0040
Optoelectronics Assembly and Packaging Technology
standard by Association Connecting Electronics Industries, 05/01/2003
IPC J-STD-013
Implementation of Ball Grid Array and Other High Density Technology
standard by Association Connecting Electronics Industries, 08/01/1996
IPC 9202
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
standard by Association Connecting Electronics Industries, 10/01/2011
IPC 4204B
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2018