IPC 9702
Monotonic Bend Characterization of Board-Level Interconnects
standard by Association Connecting Electronics Industries, 06/01/2004
Monotonic Bend Characterization of Board-Level Interconnects
standard by Association Connecting Electronics Industries, 06/01/2004
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/1996
Generic Requirements for Surface Mount Land Pattern and Design Standard – INCLUDES LAND PATTERN VIEWER SOFTWARE
standard by Association Connecting Electronics Industries, 02/01/2007
Requirements for Printed Electronics Functional Conductive Materials
standard by Association Connecting Electronics Industries, 11/01/2012
Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
standard by Association Connecting Electronics Industries, 03/01/2010
Implementation of Ball Grid Array and Other High Density Technology
standard by Association Connecting Electronics Industries, 08/01/1996
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
standard by Association Connecting Electronics Industries, 10/01/2011
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2018
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
standard by Association Connecting Electronics Industries, 10/01/2016
Design Guide for the Packaging of High Speed Electronic Circuits
Handbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2003