
IPC 2251
Design Guide for the Packaging of High Speed Electronic Circuits
Handbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2003
Design Guide for the Packaging of High Speed Electronic Circuits
Handbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2003
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
standard by Association Connecting Electronics Industries, 07/01/2013
Guide to Solder Paste Assessment
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/2006
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 08/01/2007
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2013
Surface Mount Land Pattern Round Robin Artwork
standard by Association Connecting Electronics Industries,
Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2014
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
standard by Association Connecting Electronics Industries, 05/01/2012
General Requirements for Thermally Conductive Adhesives
standard by Association Connecting Electronics Industries, 01/01/1995
Troubleshooting for Printed Board Assembly Processes
standard by Association Connecting Electronics Industries, 01/01/2019