
IPC 4103A-WAM1
Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2014
Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2014
Requirements for Printed Electronics Base Materials (Substrates)
standard by Association Connecting Electronics Industries, 05/01/2017
Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Data eXchange (PDX)
standard by Association Connecting Electronics Industries, 11/01/2001
Process Capability, Quality and Relative Reliability (PQCR2) Benchmark Test Standard and Database
standard by Association Connecting Electronics Industries, 05/01/2012
Moisture Sensitivity Classification for Non-IC Components
standard by Association Connecting Electronics Industries, 04/01/1999
Technology Assessment Handbook on Laminates
standard by Association Connecting Electronics Industries,
Standards for Printed Board Materials Manual
standard by Association Connecting Electronics Industries,
Sectional Design Standard for Flexible Printed Boards
standard by Association Connecting Electronics Industries, 11/01/2011
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 10/01/2013
Acceptability of Electronic Assemblies – Incorporates Amendment 1
standard by Association Connecting Electronics Industries, 02/01/2016