IPC J-STD-020D
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 08/01/2007
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 08/01/2007
Standards for Printed Board Materials Manual
standard by Association Connecting Electronics Industries,
Sectional Design Standard for Flexible Printed Boards
standard by Association Connecting Electronics Industries, 11/01/2011
Requirements for Printed Electronics Base Materials (Substrates)
standard by Association Connecting Electronics Industries, 05/01/2017
Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Data eXchange (PDX)
standard by Association Connecting Electronics Industries, 11/01/2001
Process Capability, Quality and Relative Reliability (PQCR2) Benchmark Test Standard and Database
standard by Association Connecting Electronics Industries, 05/01/2012
Moisture Sensitivity Classification for Non-IC Components
standard by Association Connecting Electronics Industries, 04/01/1999
Technology Assessment Handbook on Laminates
standard by Association Connecting Electronics Industries,
Conflict Minerals Data Exchange Standard
Amendment by Association Connecting Electronics Industries, 05/08/2017
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 10/01/2013