IPC CA-821
General Requirements for Thermally Conductive Adhesives
standard by Association Connecting Electronics Industries, 01/01/1995
General Requirements for Thermally Conductive Adhesives
standard by Association Connecting Electronics Industries, 01/01/1995
Technology Assessment Handbook on Laminates
standard by Association Connecting Electronics Industries,
Standards for Printed Board Materials Manual
standard by Association Connecting Electronics Industries,
Sectional Design Standard for Flexible Printed Boards
standard by Association Connecting Electronics Industries, 11/01/2011
Requirements for Printed Electronics Base Materials (Substrates)
standard by Association Connecting Electronics Industries, 05/01/2017
Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Data eXchange (PDX)
standard by Association Connecting Electronics Industries, 11/01/2001
Process Capability, Quality and Relative Reliability (PQCR2) Benchmark Test Standard and Database
standard by Association Connecting Electronics Industries, 05/01/2012
Moisture Sensitivity Classification for Non-IC Components
standard by Association Connecting Electronics Industries, 04/01/1999
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
standard by Association Connecting Electronics Industries, 07/01/2001
Conflict Minerals Data Exchange Standard
Amendment by Association Connecting Electronics Industries, 05/08/2017