IPC J-STD-033C-1
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
standard by Association Connecting Electronics Industries, 08/01/2014
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IPC 9641
High Temperature Printed Board Flatness Guideline
standard by Association Connecting Electronics Industries, 06/01/2013
IPC 4562
Metal Foil for Printed Wiring Applications, Includes Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2000
IPC M-104
Standards for Printed Board Assembly Manual
standard by Association Connecting Electronics Industries,
IPC 6015
Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
standard by Association Connecting Electronics Industries, 02/01/1998
IPC TMRC-00M
2000 Market For Electronics Manufacturing Services Providers/Contract Assembly
Report / Survey by Association Connecting Electronics Industries, 01/01/2000
IPC 2578
Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data – Product Data eXchange
standard by Association Connecting Electronics Industries, 11/01/2001
IPC 9505
Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
standard by Association Connecting Electronics Industries, 09/27/2017
IPC J-STD-001D
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005
IPC DLS-2001
Technical Proceedings for the Designers Learning Symposium – 2001
Conference Proceeding by Association Connecting Electronics Industries, 07/18/2001