IPC 7095B
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 03/01/2008
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IPC DW-424
General Specification for Encapsulated Discrete Wire Interconnection Boards
standard by Association Connecting Electronics Industries, 01/01/1995
IPC SM-840C
Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 01/01/1996
IPC SM-817A
General Requirements for Dielectric Surface Mounting Adhesives
standard by Association Connecting Electronics Industries, 12/01/2014
IPC D-326A
Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2004
IPC 4821
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2006
IPC WP-116
Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan
standard by Association Connecting Electronics Industries, 12/01/2015
IPC FLEX-CO-99
IPC National Conference Flexible Circuits Volume I & II – Denver, CO 1999
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
IPC BET-99
National Conference on Bare Board and Advanced Substrate Electrical Test: HDI's Holy Grail Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
IPC DLS-2001
Technical Proceedings for the Designers Learning Symposium – 2001
Conference Proceeding by Association Connecting Electronics Industries, 07/18/2001