IPC SM-840C
Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 01/01/1996
Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 01/01/1996
General Requirements for Dielectric Surface Mounting Adhesives
standard by Association Connecting Electronics Industries, 12/01/2014
Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2004
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2006
Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan
standard by Association Connecting Electronics Industries, 12/01/2015
IPC National Conference Flexible Circuits Volume I & II – Denver, CO 1999
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
National Conference on Bare Board and Advanced Substrate Electrical Test: HDI's Holy Grail Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
Technical Proceedings for the Designers Learning Symposium – 2001
Conference Proceeding by Association Connecting Electronics Industries, 07/18/2001
Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
standard by Association Connecting Electronics Industries, 07/01/2012
Requirements and Acceptance for Cable and Wire Harness Assemblies with Amendment 1
standard by Association Connecting Electronics Industries, 10/01/2012