IPC J-STD-028
Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
standard by Association Connecting Electronics Industries, 04/01/1999
Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
standard by Association Connecting Electronics Industries, 04/01/1999
Printed Board Description in Digital Form
standard by Association Connecting Electronics Industries, 07/01/1992
PWB Assembly Process Simulation for Evaluation of Electronic Components
standard by Association Connecting Electronics Industries, 07/10/1995
Post Solder Solvent Cleaning Handbook
standard by Association Connecting Electronics Industries, 08/01/1999
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November 2008)
standard by Association Connecting Electronics Industries, 12/01/2007
Post Solder Semiaqueous Cleaning Handbook
standard by Association Connecting Electronics Industries, 07/01/2002
Guidelines for Design, Selection and Application of Conformal Coatings
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/2013
Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 08/01/2004
Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures
standard by Association Connecting Electronics Industries, 06/01/2014
Amendment 1 to Specification for Immersion Tin Plating for Printed Circuit Boards
Amendment by Association Connecting Electronics Industries, 08/01/2012