IPC CC-830B with Amendment 1
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies – Includes Amendment 1
standard by Association Connecting Electronics Industries, 10/01/2008
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IPC 2315
Design Guide for High Density Interconnects & Microvias
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/2000
IPC FC-234A
Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid, or Rigid-Flex Printed Boards
standard by Association Connecting Electronics Industries, 11/01/2014
IPC A-25A-G
Multipurpose 1 Sided Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,
IPC D-859
Design Standard for Thick Film Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 12/01/1989
IPC 2516A
Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description
standard by Association Connecting Electronics Industries, 11/01/2000
IPC TR-465-1
Round Robin Test on Steam Ager Temperature Control Stability
standard by Association Connecting Electronics Industries, 01/01/1993
IPC TR 585
Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006
IPC D-322 (R1991)
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
Handbook / Manual / Guide by Association Connecting Electronics Industries, 09/01/1984