IPC TR 585
Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006
Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
Handbook / Manual / Guide by Association Connecting Electronics Industries, 09/01/1984
Specification for Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 01/10/1987
PWB Fabrication Data Quality Rating System
standard by Association Connecting Electronics Industries, 02/01/1999
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
standard by Association Connecting Electronics Industries, 02/01/2006
TMRC 1999 Market for Flexible Circuits – TMRC99F
Report / Survey by Association Connecting Electronics Industries, 01/01/1999
Requirements for Soldering Fluxes – includes Amendment 1
standard by Association Connecting Electronics Industries, 12/01/2008
Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2015
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 04/01/2010