
IPC TR-481
Results of Multilayer Test Program Round Robin
standard by Association Connecting Electronics Industries, 04/01/1981
Results of Multilayer Test Program Round Robin
standard by Association Connecting Electronics Industries, 04/01/1981
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
standard by Association Connecting Electronics Industries, 02/01/2012
Design Guideline for Printed Electronics
standard by Association Connecting Electronics Industries, 06/01/2013
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2000
Performance guide Manual for single- and double-sided flexible printed wiring boards
standard by Association Connecting Electronics Industries, 10/01/1999
Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
standard by Association Connecting Electronics Industries, 03/01/2010
End-Item DPMO for Printed
standard by Association Connecting Electronics Industries, 01/01/2004
Supply Chain Social Responsibility Management System Guidance
standard by Association Connecting Electronics Industries, 03/01/2017
IPC 6th Annual National Conference on Flexible Circuits: A Technology Comes of Age
standard by Association Connecting Electronics Industries, 06/01/2000
Design and Application Guidelines for Surface Mount Connectors
standard by Association Connecting Electronics Industries, 01/01/1990