IPC 6901
Application Categories for Printed Electronics
standard by Association Connecting Electronics Industries, 07/01/2015
Application Categories for Printed Electronics
standard by Association Connecting Electronics Industries, 07/01/2015
Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing
standard by Association Connecting Electronics Industries, 12/01/2010
Component Mounting Guidelines for Printed Boards
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/2004
User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
standard by Association Connecting Electronics Industries,
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
standard by Association Connecting Electronics Industries, 11/01/2003
Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
standard by Association Connecting Electronics Industries, 11/01/2012
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 03/01/2007
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 03/01/2008
Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998
Technology Reference for Design Manual
Handbook / Manual / Guide by Association Connecting Electronics Industries,