IPC J-STD-020D-1
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 03/01/2008
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IPC 2225
Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998
IPC M-106
Technology Reference for Design Manual
Handbook / Manual / Guide by Association Connecting Electronics Industries,
IPC A-42-G
Double Sided Artwork – Gerber Format
standard by Association Connecting Electronics Industries,
IPC 2501
Definition for Web-Based Exchange of XML Data
standard by Association Connecting Electronics Industries, 07/01/2003
IPC 7092
Design and Assembly Process Implementation for Embedded Components
standard by Association Connecting Electronics Industries, 02/01/2015
IPC 6013B
Qualification and Performance Specification for Flexible Printed Boards
standard by Association Connecting Electronics Industries, 01/01/2009
IPC 1131
Information Technology Guide for PWB Manufacturers
Handbook / Manual / Guide by Association Connecting Electronics Industries, 04/01/2000
IPC 2546
Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly – with Amendments 1 & 2
standard by Association Connecting Electronics Industries, 10/01/2001
IPC TP-1115
Selection and Implementation Strategy for a Low-Residue, No-Clean Process
standard by Association Connecting Electronics Industries, 12/01/1998