IPC J-STD-033B
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
standard by Association Connecting Electronics Industries, 10/01/2005
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
standard by Association Connecting Electronics Industries, 10/01/2005
Book by Association Connecting Electronics Industries, 01/01/1994
Technical Report: Wetting Balance Standard Weight Comparison Test
standard by Association Connecting Electronics Industries, 04/01/1995
Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
standard by Association Connecting Electronics Industries, 11/01/2013
Design Guide for Protection of Printed Board Via Structures
Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/2006
Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Amendment by Association Connecting Electronics Industries, 07/01/2016
Factors Affecting Insulation Resistance Performance of Printed Boards
standard by Association Connecting Electronics Industries, 03/01/1979
Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
standard by Association Connecting Electronics Industries, 03/01/2009
Book by Association Connecting Electronics Industries, 09/01/1998
Performance Standard for Ball Grid Array Balls (IPC/EIA J-STD-032)
standard by Association Connecting Electronics Industries, 06/01/2002