IPC SM-839
Pre and Post Solder Mask Application Cleaning Guidelines
standard by Association Connecting Electronics Industries, 04/01/1990
Pre and Post Solder Mask Application Cleaning Guidelines
standard by Association Connecting Electronics Industries, 04/01/1990
Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
standard by Association Connecting Electronics Industries, 12/01/2013
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
standard by Association Connecting Electronics Industries, 01/01/2015
Results of Copper Foil Rupture Strength Test Round Robin Study
standard by Association Connecting Electronics Industries, 03/01/1985
Guidelines for Electrically Conductive Surface Mount Adhesives
standard by Association Connecting Electronics Industries, 07/01/1996
Classification of Non-IC Electronic Components for Assembly Processes
standard by Association Connecting Electronics Industries, 08/01/2008
Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
standard by Association Connecting Electronics Industries, 09/01/2013
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2016
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
standard by Association Connecting Electronics Industries, 06/01/2002
Design Guide for Press Fit Rigid Printed Board Backplanes
Handbook / Manual / Guide by Association Connecting Electronics Industries, 09/01/1982