IPC TR-485
Results of Copper Foil Rupture Strength Test Round Robin Study
standard by Association Connecting Electronics Industries, 03/01/1985
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IPC 3406
Guidelines for Electrically Conductive Surface Mount Adhesives
standard by Association Connecting Electronics Industries, 07/01/1996
IPC J-STD-075
Classification of Non-IC Electronic Components for Assembly Processes
standard by Association Connecting Electronics Industries, 08/01/2008
IPC A-630
Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
standard by Association Connecting Electronics Industries, 09/01/2013
IPC 6018C
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2016
IPC EMBPAS03
IPC International Conference on Embedded Passives "The Faster and Cleaner Electronic Signals for the Future" – Northbrook, IL – June 2003
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
IPC 2222A
Sectional Design Standard for Rigid Organic Printed Boards
standard by Association Connecting Electronics Industries, 12/01/2010
IPC A-39
Small Hole Reliability Round Robin Artwork
standard by Association Connecting Electronics Industries, 09/01/1988
IPC 4101A
Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)
standard by Association Connecting Electronics Industries, 06/01/2002
IPC 2152-DE
Standard for Determining Current Carrying Capacity in Printed Board Design (Designrichtlinie für die Bestimmung der Stromtragfähigkeit von Leiterplatten)
standard by Association Connecting Electronics Industries, 05/01/2010