IPC 1752A-WAM1-2
Materials Declaration Management with Amendments 1 & 2
standard by Association Connecting Electronics Industries, 02/01/2014
Materials Declaration Management with Amendments 1 & 2
standard by Association Connecting Electronics Industries, 02/01/2014
Generic Requirements for Declaration Process Management, Includes Amendment 1
Amendment by Association Connecting Electronics Industries, 11/01/2012
Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies
standard by Association Connecting Electronics Industries, 10/01/2003
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
standard by Association Connecting Electronics Industries, 02/01/2003
Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP)
standard by Association Connecting Electronics Industries, 12/01/2015
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 02/01/2003
Multipurpose 1 & 2 Sided Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,
IPC Sample Master Ordering Agreement for EMS Companies and OEMs
standard by Association Connecting Electronics Industries, 03/01/2002
Analysis of the Market for Rigid Printed Wiring Boards and Related Materials for 1999
Report / Survey by Association Connecting Electronics Industries, 06/27/2000
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014