IPC J-STD-027
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
standard by Association Connecting Electronics Industries, 02/01/2003
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
standard by Association Connecting Electronics Industries, 02/01/2003
Requirements for Electrical Testing of Unpopulated Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2016
Specification for Finished Fabric Woven from Aramid for Printed Boards
standard by Association Connecting Electronics Industries, 06/01/1990
Materials Declaration Management with Amendments 1 & 2
standard by Association Connecting Electronics Industries, 02/01/2014
Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP)
standard by Association Connecting Electronics Industries, 12/01/2015
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 02/01/2003
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014
Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
standard by Association Connecting Electronics Industries, 09/01/2004
Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
Handbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/2012
Multipurpose 1 & 2 Sided Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,