IPC HDBK-001E
Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
Handbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/2012
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IPC A-25-G
Multipurpose 1 & 2 Sided Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,
IPC T-50G
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 12/01/2003
IPC 7711/7721
Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/1998
IPC SM-840C Amendment 1
Qualification and Performance of Permanent Solder Mask- Amendment 1
Amendment by Association Connecting Electronics Industries, 06/01/2000
IPC ML-960
Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 07/01/1994
IPC T-50K
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 06/01/2013
IPC D-640
Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring
standard by Association Connecting Electronics Industries, 06/01/2016
IPC 6016
Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
standard by Association Connecting Electronics Industries, 05/01/1999
IPC 4101
Specifications for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 12/10/1997