IPC 7095A
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 01/01/2005
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IPC 9850
Surface Mount Placement Equipment Characterization
standard by Association Connecting Electronics Industries, 07/01/2002
IPC A-610FC-Telecom(D)1
Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 01/01/2017
IPC L-108B
Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 06/01/1990
IPC J-STD-030
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
standard by Association Connecting Electronics Industries, 09/01/2005
IPC PD-335
Electronic Packaging Handbook
standard by Association Connecting Electronics Industries, 01/01/1989
IPC J-STD-001C
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 03/01/2000
IPC A-311
Process Controls for Phototool Generation and Use
standard by Association Connecting Electronics Industries, 03/01/1996
IPC 7525B
Stencil Design Guidelines
standard by Association Connecting Electronics Industries, 10/01/2011
IPC WP-1081
White Paper on Conflict Minerals Due Diligence Guidance
standard by Association Connecting Electronics Industries, 07/01/2015