IPC 7525A
Stencil Design Guidelines
standard by Association Connecting Electronics Industries, 02/01/2007
Stencil Design Guidelines
standard by Association Connecting Electronics Industries, 02/01/2007
White Paper on Conflict Minerals Due Diligence Guidance
standard by Association Connecting Electronics Industries, 07/01/2015
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 06/01/2013
Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2010
Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 07/01/2008
Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/2011
Surface Mount Placement Equipment Characterization
standard by Association Connecting Electronics Industries, 11/01/2011
The Effect of Steam Aging Time and Temperature on Solderability Test Results
standard by Association Connecting Electronics Industries, 01/01/1993
JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
standard by Association Connecting Electronics Industries, 03/01/2006