IPC A-600H
Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2010
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IPC 4104
Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999
IPC T-50H
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 07/01/2008
IPC CH-65B
Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/2011
IPC 9850A
Surface Mount Placement Equipment Characterization
standard by Association Connecting Electronics Industries, 11/01/2011
IPC TR-465-2
The Effect of Steam Aging Time and Temperature on Solderability Test Results
standard by Association Connecting Electronics Industries, 01/01/1993
IPC JP002
JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
standard by Association Connecting Electronics Industries, 03/01/2006
IPC 4204
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002
IPC A-610F
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014
IPC J-STD-026
Semiconductor Design Standard for Flip Chip Applications
standard by Association Connecting Electronics Industries, 04/01/1999