IPC T-50H
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 07/01/2008
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 07/01/2008
Surface Mount Placement Equipment Characterization
standard by Association Connecting Electronics Industries, 11/01/2011
The Effect of Steam Aging Time and Temperature on Solderability Test Results
standard by Association Connecting Electronics Industries, 01/01/1993
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002
JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
standard by Association Connecting Electronics Industries, 03/01/2006
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014
Semiconductor Design Standard for Flip Chip Applications
standard by Association Connecting Electronics Industries, 04/01/1999
SMT Assembly Benchmark Artwork – Gerber Format
standard by Association Connecting Electronics Industries,
Stencil Design Guidelines
standard by Association Connecting Electronics Industries, 02/01/2007
White Paper on Conflict Minerals Due Diligence Guidance
standard by Association Connecting Electronics Industries, 07/01/2015