IPC JP002
JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
standard by Association Connecting Electronics Industries, 03/01/2006
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IPC 4204
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002
IPC A-610F
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014
IPC 2223D
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2016
IPC A-620AS
Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies
Amendment by Association Connecting Electronics Industries, 06/01/2012
IPC D-356B
Bare Substrate Electrical Test Data Format
standard by Association Connecting Electronics Industries, 10/01/2002
IPC J-STD-030A
Selection and Application of Board Level Underfill Materials
standard by Association Connecting Electronics Industries, 02/01/2014
IPC J-STD-001E
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/2010
IPC TR-580
Cleaning and Cleanliness Test Program Phase 1 Test Results
standard by Association Connecting Electronics Industries, 10/01/1989