
IPC J-STD-001B
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/1995
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/1995
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
standard by Association Connecting Electronics Industries, 01/01/2006
UL Recognition Test Pattern – Data – D-350
standard by Association Connecting Electronics Industries,
Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 03/01/2019
Component Identification for Through Hole and Surface Mount
Training Material by Association Connecting Electronics Industries, 07/01/2002
Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2009
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 02/01/2003
Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 04/01/2016