
IPC LDFR0603
IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2009
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 02/01/2003
Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 04/01/2016
UL Recognition Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,
Printed Board Quality Evaluation Handbook
standard by Association Connecting Electronics Industries, 02/01/1999
Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards
standard by Association Connecting Electronics Industries, 06/01/2007
Guidelines for Chip-on-Board Technology Implementation
standard by Association Connecting Electronics Industries, 11/01/1990
Specification and Characterization Methods for Nonwoven "E" Glass Materials
standard by Association Connecting Electronics Industries, 09/01/1998