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IPC LDFR0603

IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003

IPC 4101C

Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2009

IPC A-610D

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005

IPC 6012DA

Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 04/01/2016

IPC A-22-G

UL Recognition Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,

IPC QE-605A

Printed Board Quality Evaluation Handbook
standard by Association Connecting Electronics Industries, 02/01/1999

IPC 5702

Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards
standard by Association Connecting Electronics Industries, 06/01/2007

IPC SM-784

Guidelines for Chip-on-Board Technology Implementation
standard by Association Connecting Electronics Industries, 11/01/1990

IPC 4130

Specification and Characterization Methods for Nonwoven "E" Glass Materials
standard by Association Connecting Electronics Industries, 09/01/1998